SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

摘要

The purpose of the present invention is to obtain a semiconductor module with a configuration which reduces the load on a molding resin and allows for the semiconductor module to have an even more compact size while still being able to be fastened to an object. A semiconductor module (7) includes a semiconductor element (1); a mounting frame (2) on which the semiconductor element (1) is mounted; a control board (5) on which a control component (14) for controlling the semiconductor element (1) is mounted; and a molding resin (8) that encapsulates the semiconductor element (1), the mounting frame (2), and the control board (5) together. The control board (5) has a fastening substrate part (5a) disposed thereon which is exposed from the molding resin (8) and is used to fasten the semiconductor module (7) to an object.