CHIP CARD DEVICE AND METHOD FOR MANUFACTURE THEREOF

摘要

The invention relates to a chip card device. This comprises a card-like carrier having received therein a semiconductor substrate in the form of a chip. The semiconductor substrate comprises at least a memory element and is provided with contact surfaces which are accessible on the surface of the card-like carrier to enable reading of the memory element therewith. The card-like carrier comprises a linear fold line configured for placing, on or close to a card part comprising the contact surfaces, a further card part situated on the side of the fold line remote from the card part.