| 摘要 |
A method for producing a semiconductor device by using an adhesive sheet obtained by forming an adhesive layer on a supportive material, the method being provided with: a wafer attachment step for attaching a semiconductor wafer to the adhesive layer; a processing method for processing the semiconductor wafer; and a detachment step for detaching the adhesive sheet from the semiconductor wafer while at a prescribed temperature. Furthermore, a step is provided for impregnating the adhesive layer with water between the processing step and the detachment step. |
