发明名称 |
LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE |
摘要 |
<p>High temperature performance hot melt adhesives are formulated for application at low temperatures below, i.e., below 300° F. Hot melt adhesives containing low levels of metallocene polymer together with a maleated polyethylene wax show an excellent balance of high and low temperature performance and are particularly useful as packaging case and carton adhesives.</p> |
申请公布号 |
EP2459665(B1) |
申请公布日期 |
2013.11.20 |
申请号 |
EP20100805084 |
申请日期 |
2010.07.30 |
申请人 |
HENKEL CORPORATION |
发明人 |
PATEL, JAGRUTI, B.;EODICE, ANDREA, KEYS;LOW, YEW, GUAN |
分类号 |
C09J123/08;C09J5/06;C09J123/20;C09J191/06 |
主分类号 |
C09J123/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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