发明名称 LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE
摘要 <p>High temperature performance hot melt adhesives are formulated for application at low temperatures below, i.e., below 300° F. Hot melt adhesives containing low levels of metallocene polymer together with a maleated polyethylene wax show an excellent balance of high and low temperature performance and are particularly useful as packaging case and carton adhesives.</p>
申请公布号 EP2459665(B1) 申请公布日期 2013.11.20
申请号 EP20100805084 申请日期 2010.07.30
申请人 HENKEL CORPORATION 发明人 PATEL, JAGRUTI, B.;EODICE, ANDREA, KEYS;LOW, YEW, GUAN
分类号 C09J123/08;C09J5/06;C09J123/20;C09J191/06 主分类号 C09J123/08
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