| 摘要 |
PURPOSE: A light emitting device and a manufacturing method thereof are provided to reduce the thickness of a chip by separating the chip from a support substrate using a chemical method. CONSTITUTION: A light emitting structure including an n-type semiconductor layer(120), an active layer(130), a p-type semiconductor layer(140), a first electrode part, and a second electrode part(160) is formed on a first substrate. A second substrate with a sacrificial layer is prepared. A support substrate is bonded to the light emitting structure. The first substrate is removed from the light emitting structure. One or more posts(PP) fixing the light emitting structure are formed on the support substrate. The light emitting structure is separated from the support substrate by selectively etching the sacrificial layer. |
