发明名称 METHOD AND DEVICE FOR MEASURING TEMPERATURE OF SUBSTRATE IN VACUUM PROCESSING APPARATUS
摘要 Disclosed are a method and a device for determining the temperature of a substrate in a vacuum processing device during a process for manufacturing the substrate. The method for determining the temperature of a substrate in a vacuum processing device by the present invention comprises the steps of: disposing a substrate to be measured on a susceptor of a vacuum processing device for a manufacturing process and selecting i wavelengths from radiance emitted from the susceptor and passing through the substrate, where i is a natural number greater than 1; and obtaining the temperature of the substrate based on the i radiances and the i wavelengths by using a mathematical equation. The substrate temperature measuring mechanism of the present invention has high accuracy and high reliability. [Reference numerals] (AA) Start;(BB) End;(S1) Selecting i wavelengths from radiance emitted from the susceptor and passing through the substrate, where i is a natural number greater than 1;(S2) Obtaining at least one radiance corresponding to selected i wavelength;(S3) Calculating temperature of substrate based on i radiance and i wavelength, using the following mathematical equation
申请公布号 KR20130124907(A) 申请公布日期 2013.11.15
申请号 KR20130050985 申请日期 2013.05.06
申请人 ADVANCED MICRO-FABRICATION EQUIPMENT INC, SHANGHAI 发明人 LI YOUSEN;STEVEN LEE;DAVID ZHEHAO CHEN
分类号 H01L21/205;H01L21/66 主分类号 H01L21/205
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