| 发明名称 |
BUMP STRUCTURE, SEMICONDUCTOR PACKAGE HAVING THE BUMP STRUCTURE, AND METHOD OF MANUFACTURING THE BUMP STRUCTURE |
| 摘要 |
<p>A bump structure includes a first bump and a second bump. The first bump is arranged on a connection pad. A lower part having a first width is extended from the connection pad. A center part has a second width that is smaller than the first width. An upper part has a third width that is larger than the second width. The second bump is arranged on the upper part of the first bump.</p> |
| 申请公布号 |
KR20130124637(A) |
申请公布日期 |
2013.11.15 |
| 申请号 |
KR20120047896 |
申请日期 |
2012.05.07 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
MYUNG, JONG YUN;KWON, YONG HWAN;SHIM, JONG BO;CHO, MOON GI |
| 分类号 |
H01L23/488 |
主分类号 |
H01L23/488 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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