SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS

摘要

PROBLEM TO BE SOLVED: To achieve stabilization of a distance between a light emitting side and a light-receiving side and inhibit deviation without employing spot welding when arranging a light-emitting side lead frame on which a light-emitting element is mounted and a light-receiving side lead frame on which a light-receiving element is mounted opposite to each other to perform overlapping processing.SOLUTION: A semiconductor device comprises a first lead frame on which a semiconductor element is mounted and a second lead frame on which a semiconductor element is mounted. The semiconductor device includes a projection part for fitting and fixing the first lead frame and the second lead frame by folding either or both of the first lead frame and the second lead frame toward the other lead frame side when the first lead frame and the second lead frame are arranged opposite to each other.