| 摘要 |
PROBLEM TO BE SOLVED: To uniformize heat distribution in an image sensor chip.SOLUTION: A solid state imaging apparatus comprises: the image sensor chip comprising a pixel area with plural pixels arranged therein and a peripheral area disposed in the periphery of the pixel area; and a fixation unit for fitting the image sensor chip to a holding unit for holding the image sensor chip. The peripheral area comprises a first portion and a second portion, the first portion being larger in calorific value than the second portion. The fixation unit is configured such that a heat conductance from the first portion to the holding unit is larger than that from the second portion to the holding unit. |
