| 摘要 |
<p>The present invention relates to an electronic device, and more particularly relates to dissipation of heat generated by computer devices, such as a server, a network device, a PC, and a notebook computer. A water-cooling combined heat dissipation device for a heat pipe comprises a heat pipe member, a water-resisting member, and a water-cooling member. The heat pipe member is mainly formed by a heat pipe (1), and is installed on each main heat generating member in a case. The heat pipe (1) is installed with a water-resisting member, so as to isolate an evaporating end (4) of the heat pipe (1) from a condensing end (5). The water-resisting member is a water-resisting board (3), installed on a case housing or a water-resisting board of the case, so as to enable the water-cooling member to be installed out of the case or in a space of the case isolated from electronic devices. One type of the water-cooling member is a water tank (2), comprising a water inlet hole (6), a water outlet hole (7), and a water bath (8), the condensing end (5) of the heat pipe (1) is inserted into the water bath (8) of the water tank (2), and heat of the heat pipe (1) may be directly exchanged into cooling water. Another type of the water-cooling member is a water-cooling head, comprising a water inlet hole, a water outlet hole, and a heat-conducting board, and the condensing end of the heat pipe is connected to the heat-conducting board. An advantage of the solution is that the water-cooling part is isolated from the electronic devices, so as to lower a risk that the electronic devices are destroyed because of leak of the cooling water, and meanwhile, a heat flow density adjustable characteristic of the heat pipe may be used to increase a heat exchange area between the cooling water and a heat generating source, so as to improve heat dissipation efficiency.</p> |
