| 摘要 |
<p>Methods, systems, and devices for providing cooling for a mobile device using piezoelectric active cooling devices. Embodiments utilize piezoelectric actuators (122) that oscillate a planar element (124) within an air channel (115) to fan air within or at an outlet of the air channel. The air channel may be defined by at least one heat dissipation surface (112) in thermal contact with components of the mobile device that generate excess waste heat. For example, the air channel may include a surface that is in thermal contact with a processor of the mobile computing device. In embodiments, the piezoelectric active cooling device may be used in an air gap between stacked packages in a package on package (PoP) processor package. The described embodiments provide active cooling using low power, can be controlled to provide variable cooling, use highly reliable elements, and can be implemented at low cost.</p> |
