SEMICONDUCTOR DEVICE AND MEASUREMENT INSTRUMENT

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and a measurement instrument, which achieve downsizing and reduction in wiring resistance.SOLUTION: A semiconductor device comprises: a lead frame 26; an oscillator 28 which includes a plurality of terminals spaced at predetermined intervals and which is mounted on an oscillator mounting region formed on a first surface of the lead frame 26 and having a width narrower than an interval between the terminals; an integrated circuit 30 mounted on a second surface of the lead frame 26 on an opposite side to the first surface; and bonding wires 52 for connecting the terminals of the oscillator 28 and terminals of the integrated circuit 30.