| 摘要 |
PROBLEM TO BE SOLVED: To reduce the pitch between terminals by reducing the amount of solder required for connection in reflow solder, thereby reducing the print range of each solder paste.SOLUTION: The method of manufacturing a terminal 10 having a substrate connection 12 for connection with a circular through hole B1 formed to penetrate a substrate B includes a wire drawing step for producing a wire material having a polygonal cross section, where each interior angle is an obtuse-angle, by drawing from the opening of a wire drawing die having a polygonal opening, where each interior angle is an obtuse-angle, a surface treatment step for performing surface treatment of the wire material, and a cutting step for forming the substrate connection 12 by cutting the wire material subjected to surface treatment at a fixed length. |
