| 摘要 |
PURPOSE: A manufacturing method of printed circuit board is provided to improve the production efficiency by filling inside the through hole in the process of copper plating. CONSTITUTION: An insulating layer is prepared (S110). The through hole is formed in the insulating layer (S120). A seed layer is formed in the insulating layer (S130). A copper foil layer is formed at both sides of the insulating layer (S140). A circuit pattern is formed in the copper foil layer. [Reference numerals] (S110) Prepare an insulating layer; (S120) Form a through hole; (S130) Form a seed layer; (S140) Fill the through hole and form a copper foil layer |
