发明名称 JOINING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a joining method capable of preventing formation of an Al-Cu eutectic and corrosion of a base material by melting the eutectic when joining a Cu material and an Al material by brazing.SOLUTION: When joining a Cu material 12 containing copper and an Al material 14 containing aluminum by using an Al brazing filler metal 16, a multilayered plating layer including a first Ni plating layer 18 containing nickel and formed on a joint surface 12a of the Cu material 12, a Cr plating layer 20 containing chrome and formed on the first Ni plating layer 18, a second Ni plating layer 22 containing nickel and formed on the second Cr plating layer 20 are provided as an intermediate member 23, and before brazing process, the Cu material 12, in which the intermediate member 23 comprising a multilayered plating layer is provided on the joint surface 12a, is heat treated.
申请公布号 JP2013230484(A) 申请公布日期 2013.11.14
申请号 JP20120103531 申请日期 2012.04.27
申请人 FUJI ELECTRIC CO LTD 发明人 OGURA KEISUKE;KURA KAORU
分类号 B23K1/20;B23K1/19;B23K103/18;C25D5/14;C25D5/50 主分类号 B23K1/20
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