发明名称 |
METHOD FOR PROCESSING PRINTED CIRCUIT BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for processing a printed circuit board easily and efficiently.SOLUTION: There is provided a method for processing a printed circuit board in which electronic members each containing metals and resins are solder-welded onto a substrate containing metal and resin. The method for processing the printed circuit board includes a first processing method and a second processing method. The first processing method includes the steps of: placing the printed circuit board on a first net plate; heating the placed printed circuit board; separating the electronic members from the printed circuit board; and recovering the electronic members and the solder in vessels. The second processing method includes the steps of: cleaning the electronic member-separated board with hydrochloric acid; and heating each of the recovered electronic members and the cleaned electronic member-separated board to carbonize the resins. |
申请公布号 |
JP2013230437(A) |
申请公布日期 |
2013.11.14 |
申请号 |
JP20120103871 |
申请日期 |
2012.04.27 |
申请人 |
ASTEC IRIE CO LTD |
发明人 |
INOUE NOBUHIRO;KOMORI YUJI;KONISHI MASAKAZU;INOUE EIJI;KANEGAE SHIGEMITSU;HASHIGUCHI SHOICHI |
分类号 |
B09B3/00;B09B5/00;C08J11/12;C22B1/00;C22B7/00;C22B13/02;C22B25/06 |
主分类号 |
B09B3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|