发明名称 METHOD FOR PROCESSING PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for processing a printed circuit board easily and efficiently.SOLUTION: There is provided a method for processing a printed circuit board in which electronic members each containing metals and resins are solder-welded onto a substrate containing metal and resin. The method for processing the printed circuit board includes a first processing method and a second processing method. The first processing method includes the steps of: placing the printed circuit board on a first net plate; heating the placed printed circuit board; separating the electronic members from the printed circuit board; and recovering the electronic members and the solder in vessels. The second processing method includes the steps of: cleaning the electronic member-separated board with hydrochloric acid; and heating each of the recovered electronic members and the cleaned electronic member-separated board to carbonize the resins.
申请公布号 JP2013230437(A) 申请公布日期 2013.11.14
申请号 JP20120103871 申请日期 2012.04.27
申请人 ASTEC IRIE CO LTD 发明人 INOUE NOBUHIRO;KOMORI YUJI;KONISHI MASAKAZU;INOUE EIJI;KANEGAE SHIGEMITSU;HASHIGUCHI SHOICHI
分类号 B09B3/00;B09B5/00;C08J11/12;C22B1/00;C22B7/00;C22B13/02;C22B25/06 主分类号 B09B3/00
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