| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device capable of simultaneously performing high precision polishing to a plurality of polishing objects.SOLUTION: In a polishing device 1 that are provided with: a polishing pad 11 including a polishing face capable of polishing polishing objects 5, 6; a rotatable polishing surface plate holding the polishing pad 11 with a polishing face upward directed; and a plurality of head parts 20a-20c disposed above the polishing surface plate and holding the polishing objects 5, 6 with faces to be polished of the polishing objects 5, 6 downward directed, the polishing pad 11 is composed to be capable of simultaneously polishing the plurality of polishing objects 5, 6 held on the plurality of head parts 20a-20c respectively. Head driving mechanisms 30a-30c are provided that move the plurality of head parts 20a-20c in a two-dimensional direction roughly parallel with the polishing face of the polishing pad 11, respectively. |
