| 摘要 |
A workpiece dividing method for dividing a platelike workpiece into a plurality of individual chips. The workpiece dividing method includes a workpiece preparing step of preparing the platelike workpiece, at least one side of the workpiece being formed as a mat surface, a holding step of holding the workpiece on a holding surface of a chuck table in the condition where the mat surface of the workpiece is exposed, a cut groove forming step of cutting the mat surface of the workpiece held on the holding surface of the chuck table by using a cutting blade to thereby form a cut groove with a remaining portion, and a laser cutting step of applying a laser beam to the workpiece along the cut groove to thereby cut the remaining portion. |
