METHOD FOR ESTIMATING INTERFACE BONDING PROPERTIES IN LAYERED MATERIALS USING DIGITAL IMAGE ANALYSIS

摘要

The present invention relates to a method for evaluating bonding properties of a multi-layered metal plate using a digital image interpretation technique and, more particularly, to a method for evaluating interface bonding properties in a tension test which is a method for evaluating mechanical properties of a general metal specimen and is simpler than the conventional methods for evaluating interface bonding properties. In addition, through digital image analysis, the existence of interface bonding can be determined by analyzing the distance between layers, a local deformation rate, etc. The analysis on a bonding property can become easy through the relationship with a transformation rate-stress curve, which is a general property of a material and is obtained from a tension test. A method for analyzing interface bonding properties prepared by the present invention comprises the following steps of: (a) realizing a random pattern on a side of a specimen; (b) obtaining an image of the side of the specimen through an in-situ or an ex-situ test simultaneously with a tension test; (c) observing interface properties through digital image interpretation.