摘要 |
<p>The present invention relates to an apparatus for breaking glass substrates. The objective of the present invention is to provide an apparatus for breaking glass substrates capable of preventing crack diffusion of glasses in removal of trim of glass substrates, in which scribing fail is generated during a glass substrate cutting process, and total damage of the glass substrate caused thereby. The apparatus for breaking glass substrates according to the present invention comprises: a breaking bar, which is connected to a linear driver and capable of elevating and descending, and which has a predetermined width and is composed to be extended in one direction; a plurality of linear bushes which includes shafts slid inside an outer container and capable of linearly exercising, and which is installed along the longitudinal direction of the breaking bar; a plurality of buffer cylinders which includes hollow cylinder bodies, in which pressure force is formed inside, pistons contained in the cylinder bodies, and piston rods connected to the piston, and which is installed along the longitudinal direction of the breaking bar; and a breaking tip with a predetermined width which is formed into a rod shape, is extended in one direction, is installed along the longitudinal direction of the breaking bar at the lower part of the breaking bar and is connected to the piston rod of the buffer cylinder and the shaft of the linear bushes, and contacts and adds load to the glass substrates by descending the breaking bar.</p> |
申请人 |
SAMSUNG CORNING PRECISION MATERIALS CO., LTD. |
发明人 |
ROH, HYUNG SANG;KOO, JA YONG;KIM, SUNG CHEAL;PARK, WON KYU;LEE, CHANG HA |