| 摘要 |
<p>The present invention relates to a wafer transfer apparatus and, more specifically, to a wafer transfer apparatus changing the speed of a wafer transferred vertically, facilitating height adjustment, and reducing the installation and maintenance costs due to a simple configuration. The wafer transfer apparatus has a structure comprising a drive unit having screw shafts formed with fixed lengths installed at an arm part on which the wafer is placed and at one side of a motor; a transfer member having a connection shaft installed at the upper part of one side surface thereof to be connected to the bottom side of the arm part, protruded wing pieces formed on both sides thereof, transfer rails installed at the lower parts of the wing pieces, and a through hole formed on the lower end of the connection shaft, wherein a connection member is installed in the through hole for the connection member to be connected and combined with the screw shaft of the drive unit; and a C-shaped support frame having a guide rail with a fixed length therein for the transfer rails of the transfer member to be transferred by being settled and combined, having a through hole formed one side for the connection shaft of the transfer member connected to be inserted in and combined with the arm part (10) formed one side, and a through hole formed on the other side for the screw shaft of the drive unit to be inserted and combined.</p> |
