Semiconductor chip to dissipate heat, semiconductor package including the same, and stack package using the same

摘要

A semiconductor chip includes a semiconductor chip body having a top surface, a bottom surface, and side surfaces. The bottom surface may have a groove pattern defined by removing a partial thickness of the semiconductor chip body to extend from one or more edges of the semiconductor chip body toward a center portion of the semiconductor chip body. Through electrodes may be formed to extend from the top surface of the semiconductor chip body and pass through the groove pattern defined on the bottom surface. A heat dissipation pattern may fill in the groove pattern defined on the bottom surface and may be connected with the through electrodes.