发明名称 |
Double solid metal pad with reduced area |
摘要 |
An integrated circuit structure includes a bond pad; an Mtop pad located directly underlying the bond pad; an Mtop-1 pad having at least a portion directly underlying the Mtop pad, wherein at least one of the Mtop pad and the Mtop-1 pad has a horizontal dimension smaller than a horizontal dimension of the bond pad; a plurality of vias interconnecting the Mtop pad and the Mtop-1 pad; and a bond ball on the bond pad. Each of the Mtop pad and the Mtop-1 pad has positive enclosures to the bond ball in all horizontal directions.
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申请公布号 |
US8581423(B2) |
申请公布日期 |
2013.11.12 |
申请号 |
US20080272501 |
申请日期 |
2008.11.17 |
申请人 |
CHEN HSIEN-WEI;LIU YU-WEN;TSAI HAO-YI;JENG SHIN-PUU;CHEN YING-JU;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHEN HSIEN-WEI;LIU YU-WEN;TSAI HAO-YI;JENG SHIN-PUU;CHEN YING-JU |
分类号 |
H01L23/52;H01L23/48;H01L29/40 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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