发明名称 |
SEMICONDUCTOR LIGHT EMITTING CHIP AND METHOD FOR MANUFACTURING THEREOF |
摘要 |
<p>The present invention provides a semiconductor light emitting chip comprising a metal electrode; a column support part which is formed on the metal electrode with n-type semiconductor materials; n-type cladding which includes a column part formed in a multi-column shape on the column support part with n-type semiconductor materials; an activation part which conformally surrounds the column part, which is formed between the column parts on the column support part, and in which a quantum well layer and a barrier layer are alternately laminated; p-type cladding which is formed on the activation part with p-type semiconductor materials; and a transparent electrode which is formed on the p-type cladding.</p> |
申请公布号 |
KR20130122859(A) |
申请公布日期 |
2013.11.11 |
申请号 |
KR20120045968 |
申请日期 |
2012.05.01 |
申请人 |
CHIP TECHNOLOGY CO., LTD. |
发明人 |
KWON, SE HUN;MIN, JAE SIK;CHO, BYOUNG GU |
分类号 |
H01L33/22;H01L33/04;H01L33/06 |
主分类号 |
H01L33/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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