发明名称 SEMICONDUCTOR PROCESS CHAMBER
摘要 The present invention relates to a semiconductor chamber including a chamber body; a chamber lead installed on the top surface of the chamber body; a showerhead installed in an inner space formed by the chamber body and the chamber lead; an oring installed on the edge bottom surface of the chamber body or the edge top surface of the chamber body. Particularly, an arcking prevention insert is installed in a separation space between the chamber lead and the chamber body generated by the oring. The arcking prevention insert touches the outside surface of the chamber body in a main body. A flange is formed in the upper part of the main boy and between the chamber body and the chamber lead. An arching phenomenon is fundamentally prevented.
申请公布号 KR101326386(B1) 申请公布日期 2013.11.11
申请号 KR20130049744 申请日期 2013.05.03
申请人 LEE, CHEUN YONG 发明人 LEE, CHEUN YONG
分类号 H01L21/02;H01L21/203;H01L21/205 主分类号 H01L21/02
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