| 摘要 |
Method for connecting several layers made from a semiconductor material and a replacement substrate comprises using a joining layer formed by thermal compression. The layers contains a thermally connecting material. Independent claims are also included for the following: (1) Component, especially a wafer, comprising a semiconductor material and a joining layer; (2) Method for the production of organic luminous diode; and (3) Organic luminous diode produced using the above method. |
