METHOD FOR MOUNTING ELECTRONIC COMPONENT ON CIRCUIT BOARD

摘要

The present invention relates to a method for mounting components of a printed circuit board, which is able to increase the adhesion strength of an insertion mounted component because a pre-soldered high temperature solder adhesion layer is spread towards a low temperature solder when soldering the lead of the insertion mounted component for which is able to simplify a manufacturing process by successively soldering a surface mounted component and the insertion mounted component by using a reflow soldering process and soldering the lead of the insertion mounted component by printing the low temperature solder on the high temperature solder adhesion layer which is melted and coated on an insertion hole when soldering the insertion mounted component. The method for mounting components of a printed circuit board includes the following steps of: preparing a substrate (S10); printing a high temperature solder together in a land formed in the substrate and in an insertion hole adjacent to the land (S20); mounting a surface mounted component on the land in which the high temperature solder is printed (S30); forming a high temperature solder adhesion layer in the insertion hole while soldering the surface mounted component to the land by making the substrate of the step (S30) pass through a high temperature reflow path (S40); printing a low temperature solder in the insertion hole in which the high temperature solder adhesion layer is formed (S50); mounting an insertion mounted component so that the lead of the insertion mounted component penetrates and is inserted into the insertion hole in which the low temperature solder is printed (S60); and making the substrate of the step (S60) pass through a low temperature reflow path and soldering the insertion mounted component to the insertion hole (S70).