| 摘要 |
The present invention relates to an electroplating apparatus for hollow shaped parts comprising: a base unit which comprises multiple stack parts installed on the top side for being laminated in order to form a path, in which a plating solution passes through a hollow of a hollow shaped part and a distribution route for distributing and supplying the plating solution injected through an inlet to the hollow of the laminated hollow shaped part through each stack part; a negative electrode bar which is installed on the base unit, is arranged to be connected to a side part in each row in which the hollow shaped part is laminated and acts as a negative electrode; an elevation unit which is connected to or separated from the top side of the layer, in which the hollow shaped part is laminated, in order to maintain airtight by elevation and contains a discharge route for discharging the plating solution emitted through the hollow; an elevation operating unit which is installed to elevate the elevation unit; and a positive electrode bar which is arranged to be inserted in each hollow of the hollow shaped parts laminated on the bottom side of the elevation unit and contains a positive electrode bar acting as a positive electrode. According to the present invention, the yield of electroplating is increased by performing electroplating without surface coating agents and arranging the hollow shaped part in multiple rows, and the quality of electroplating is improved by increasing the reliability of the connection of the hollow shaped part and negative electrode bar. Additionally, electroplating is effectively performed by simplifying and facilitating the operation of electrode. |
