| 摘要 |
A molding method and a molding apparatus for manufacturing a semiconductor package are provided to separate the molded semiconductor chip from an upper mold and a lower mold by using the air. A molding unit(14) molds a member(10) mounting a semiconductor chip by providing molding resin to the member mounting the semiconductor chip positioned in a cavity. A path forming unit(21) forms the path composed of a micro gap between an upper mold(11) and a lower mold(13). An air injecting unit(23) separates the member mounting the molded semiconductor chip from the upper mold and the lower mold by injecting the air to the path. |
