发明名称 DESIGN METHOD FOR POWER SEMICONDUCTOR MODULE
摘要 PROBLEM TO BE SOLVED: To provide a design method for a power semiconductor module capable of reducing noise and size while avoiding oscillation.SOLUTION: A design method includes: a step of integrating an inverse of a hole speed over a thickness of a depletion layer generated at a bipolar type power semiconductor element to calculate a hole propagation time in the bipolar type power semiconductor element; and a step of determining whether or not a resonance frequency of an equivalent circuit to a power semiconductor module is within a predetermined range including a frequency represented by an inverse of the hole propagation time. Since oscillation can be avoided by predicting presence or absence of oscillation by a short-time simulation, a noise of the power semiconductor module can be reduced. Further, because a need for providing a high-frequency loss element for avoiding the oscillation on a substrate can be eliminated, the power semiconductor module can be downsized.
申请公布号 JP2013229383(A) 申请公布日期 2013.11.07
申请号 JP20120098931 申请日期 2012.04.24
申请人 MITSUBISHI ELECTRIC CORP 发明人 FUJITA SHIGETO
分类号 H01L25/07;H01L25/18 主分类号 H01L25/07
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