发明名称 TWO-STEP SILICIDE FORMATION
摘要 One embodiment of the present invention comprises a transistor having a source/drain region within a substrate, an extension region within the substrate adjoining the source/drain region and extending toward a gate on the substrate, and a dielectric spacer against the gate wherein the dielectric spacer covers at least part of the extension region. A silicide intermix layer is formed over both the source/drain region and a portion of the extension region. A silicide contact is formed through the silicide intermix layer over the source/drain region.
申请公布号 US2013295765(A1) 申请公布日期 2013.11.07
申请号 US201313937698 申请日期 2013.07.09
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 ALPTEKIN EMRE;JAIN SAMEER H.;VEGA REINALDO A.
分类号 H01L21/3205 主分类号 H01L21/3205
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