| 摘要 |
An apparatus to fabricate a flip-chip package (FCP), and a method of fabricating an FCP using the same. The method includes providing a semiconductor chip such that an active surface on which a bump is formed faces upward, picking up the semiconductor chip using a pickup transfer and rotating the semiconductor chip such that the active surface of the semiconductor chip faces downward, directly transferring the semiconductor chip from the pickup transfer to a mount transfer, and mounting the semiconductor chip on a transfer unit using the mount transfer such that the active surface faces downward. |
