发明名称 |
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE HAVING THE SAME, AND STACKED SEMICONDUCTOR PACKAGE USING THE SEMICONDUCTOR PACKAGE |
摘要 |
A semiconductor package includes a semiconductor chip having a front surface and a back surface; through electrode formed in the semiconductor chip to pass through the front surface and the back surface and having a first end which is disposed on the front surface and a second end which is disposed on the back surface; and back-side bump formed over the second end of the through electrode and including an embedded pattern which is formed over a portion of the second end of the through electrode and a conductive pattern which is formed over the embedded pattern and a remaining portion of the second end of the through is electrode and having a convex sectional shape. |
申请公布号 |
US2013292818(A1) |
申请公布日期 |
2013.11.07 |
申请号 |
US201213614869 |
申请日期 |
2012.09.13 |
申请人 |
JO SEUNG HEE;SK HYNIX INC. |
发明人 |
JO SEUNG HEE |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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