| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing apparatus and a method for manufacturing the same reducing manufacturing cost of a three-dimensional semiconductor device. <P>SOLUTION: An integrated circuit chip bonding apparatus 1 manufactures a three-dimensional semiconductor device by stacking a plurality of memory chips 41 with copper terminals on an upper and lower faces on a base board 40 with copper terminals on an upper face and bonding the copper terminals to each other. The integrated circuit chip bonding apparatus 1 includes: a hydrogen plasma cleaner section 2 for exposing the base board 40 and the memory chips 41 in a hydrogen plasma atmosphere to remove oxide films formed on the copper terminals; and a chip mounting section 30 sequentially stacking integrated circuit chips of the memory chips 41, from which the oxide films of the copper terminals have been removed, on the base board 40, from which the oxide films of the copper terminals have been removed, and pressing and bonding the copper terminals formed on mutually opposed surfaces to each other in a non-oxygen atmosphere. The base board 40 and the memory chips 41 are thereby transferred from the hydrogen plasma cleaner section 2 to the chip mounting section 30 in a non-oxygen atmosphere. <P>COPYRIGHT: (C)2010,JPO&INPIT |
