Process and device for the wave or vapor-phase soldering of electronic units

摘要

PCT No. PCT/DE96/00968 Sec. 371 Date Dec. 12, 1997 Sec. 102(e) Date Dec. 12, 1997 PCT Filed May 24, 1996 PCT Pub. No. WO96/37330 PCT Pub. Date Nov. 28, 1996A method of and an apparatus for vapor phase/solder wave soldering contacts of electronic components including temperature sensitive portions in which the components while moving through a soldering chamber are only partially immersed in a saturated vapor whereas the contacts are wholly immersed in the vapor. A solder wave having a crest substantially coinciding with the components to be soldered is provided within the saturated vapor and a layer of an inert gas is provided above the vapor ceiling.