发明名称 LAMINATED SHEET FOR PACKAGING ELECTRONIC COMPONENT AND MOLDED BODY THEREOF
摘要 The present invention discloses a laminated sheet for packaging electronic components comprising a front surface layer, a center core layer and a rear surface layer, wherein the front surface layer and the rear surface layer each contains a rubber-modified styrenic copolymer (A) having a graft ratio of grafted rubber of 30 to 50%, a grafted rubber particle diameter of 0.1 to 0.5 mum and a butadiene content of 5 to 25% by weight, and polyetheresteramide (B), and the center core layer contains a rubber-modified styrenic copolymer (C) having a graft ratio of grafted rubber of 70 to 90%, a grafted rubber particle diameter of 0.4 to 1.0 mum, and a butadiene content of 5 to 15% by weight, and 5 to 50% by weight of a recycled material of this laminated sheet.
申请公布号 US2013295307(A1) 申请公布日期 2013.11.07
申请号 US201213981223 申请日期 2012.01.25
申请人 FUJIWARA JUNPEI;KAWATA MASATOSHI;MIYAMURA YASUSHI;DENKI KAGAKU KOGYO KABUSHIKI KAISHA 发明人 FUJIWARA JUNPEI;KAWATA MASATOSHI;MIYAMURA YASUSHI
分类号 B32B25/02;B32B1/02;B32B7/02 主分类号 B32B25/02
代理机构 代理人
主权项
地址