ULTRASONIC PROBE

摘要

The present invention provides an ultrasonic probe discharging heat generated in an integrated circuit in which a capacitive micromachined ultrasonic transducer (cMUT) is bonded to the outside. The ultrasonic probe comprises: a transducer generating ultrasonic waves; the integrated circuit installed at the rear side of the transducer; a printed circuit board having the opening installed at the rear side of the integrated circuit and formed in order for the rear side of the integrated circuit to be exposed; a heat spreader inserted into the opening of the printed circuit board and in which a protrusion absorbing the heat generated in the integrated circuit is formed; and a radiating module discharging the heat absorbed in the heat spreader to the outside.