| 摘要 |
<p>There is provided a method for improving heat dissipation in systems that use LEDs (1) with high power density mounted on a printed circuit board (2), said LEDs (1) each being provided, on a face (la) thereof, with a plurality of electrical contacts (5) usable for connecting electrically the LEDs (1) to conducting tracks made on said board (2), said LEDs (1) being also provided, on said face (la), with a heat dissipating element (6), said board (2) comprising a substrate (3) made of heat-conducting material, covered by a layer of electrically insulating material (4), on which said conducting tracks are made, said LEDs (1) being mounted on said board (2) in such a manner that said face (la) with said heat dissipating element (6) faces said layer (4) of electrically insulating material, said method comprising the following steps: - removing the material of said electrically insulating layer (4) at a contact zone (7) between said heat dissipating element (6) of each LED (1) and said electrically insulating layer (4); - making a heat-conducting connection (8) between said heat dissipating element (6) and said substrate (3).</p> |
