发明名称 LASER CUTTING APPARATUS AND LASER CUTTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a laser cutting apparatus capable of cutting a cutting object without a cuttable limit on a thickness and a shape of a plate even if a cutting condition of the cutting object is unknown, and to provide a laser cutting method.SOLUTION: A laser cutting apparatus that transmits laser light from a laser light source to a laser irradiation head through an optical fiber and irradiates a cutting object via an optical system disposed inside the laser irradiation head, includes: a shape measuring mechanism for measuring a shape in the vicinity of a cut position of the cutting object; a condensing lens system for condensing the laser light; a scanning mechanism for scanning an irradiation position of the cutting object by the laser light along a cutting direction by driving optical components; and a control unit for controlling an irradiation state of the laser light with respect to the cutting object. The control unit drives the scanning mechanism while fixing a position of the laser irradiation head, and repeatedly scans and irradiates the cutting part of the cutting object with the laser light a plurality of times.
申请公布号 JP2013226590(A) 申请公布日期 2013.11.07
申请号 JP20120101844 申请日期 2012.04.26
申请人 TOSHIBA CORP 发明人 SHIIHARA KATSUNORI;SENDA ITARU
分类号 B23K26/38;B23K26/00;B23K26/08 主分类号 B23K26/38
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