| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a flexible printed wiring board, including a plurality of conductive layers connected electrically via blind via holes, efficiently, and to provide an automatic adhesive removal device for use in the method of manufacturing a flexible printed wiring board.SOLUTION: The method of manufacturing a flexible printed wiring board 1 at least includes a laminate preparation step A, a blind via hole formation step C, and a metal film layer formation step D. The metal film layer formation step D includes a laminate bonding step D1 for bonding two laminates 1a, each having a blind via hole B, via an adhesive 30, a metal film layer simultaneous formation step D2 for forming a metal film layer 40, simultaneously, in the blind via holes B of two laminates 1a thus bonded, and a laminate separation step D3 for separating two laminates 1a after formation of the metal film layer 40. |
