发明名称 |
ENCAPSULATING PACKAGE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ENCAPSULATING PACKAGE |
摘要 |
The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which a vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole.
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申请公布号 |
US2013291380(A1) |
申请公布日期 |
2013.11.07 |
申请号 |
US201313933278 |
申请日期 |
2013.07.02 |
申请人 |
YAMAZAKI TAKAO;SANO MASAHIKO;KURASHIMA SEIJI;SOGAWA YOSHIMICHI;NEC CORPORATION |
发明人 |
YAMAZAKI TAKAO;SANO MASAHIKO;KURASHIMA SEIJI;SOGAWA YOSHIMICHI |
分类号 |
H05K3/30 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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