| 摘要 |
PROBLEM TO BE SOLVED: To inhibit the deterioration of heat stress resistance of solder.SOLUTION: A joining surface (141) of a heat radiation member (14) is joined to a metal layer (13) by solder (10). A protruding part (100) is formed on the joining surface (141) of the heat radiation member (14) so as to overlap with at least a part of a peripheral part (11a) of a substrate (11) without overlapping with the metal layer (13) in a plane view. A thickness (Ds) of the solder (10) is set so as to be thinner than a protruding height (Dc) of the protruding part (100) and the protruding height (Dc) of the protruding part (100) is set so as to be lower than or equivalent to a total thickness of the thickness (Ds) of the solder (10) and the thickness (Dm) of the metal layer (13). |
