| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a smaller wiring board necessitates reduction in the size of an exposed surface of a connecting wiring which is laser-processed, and when the exposed surface becomes smaller in this manner, time taken for etching increases, thus increasing its impact on a metal pad. SOLUTION: The wiring board 1 includes: an insulating substrate 3; metal pads 5 disposed on the surface of the insulating substrate; floating pads 7 disposed on the surface of the insulating substrate; first connecting wires 21 which have at least part buried in the insulating substrate and are electrically connected to the floating pads; second connecting wires 23 which have at least part buried in the insulating substrate and are electrically connected to the metal pads, wherein the first connecting wires and second connecting wires are mutually separated, and have an ingredient, as the main ingredient, with a higher ionization tendency than the main ingredient of the metal pads. COPYRIGHT: (C)2010,JPO&INPIT |
