发明名称
摘要 PROBLEM TO BE SOLVED: To provide a composite semiconductor device having a semiconductor element and a sensor element formed on the same semiconductor layer and capable of detecting the temperature of the semiconductor element in a wide temperature region. SOLUTION: In this composite semiconductor device, an FRD and a plurality of SBDs are formed on a first semiconductor layer 1. In the composite semiconductor device, the FRD11 is composed of the first semiconductor layer 1, a P-type second semiconductor layer 2 formed on the first semiconductor layer 1 in an island-like shape, and having a PN junction formed with the first semiconductor layer 1, and a first electrode 5 formed on the second semiconductor layer 2 and electrically connected to the semiconductor layer 2; the SBD 12a is formed with a first electrode 5 forming a Schottky junction between the first semiconductor layer 1 and itself; the SBD 12b is separated from the SBD 12a, and formed with a second electrode 6 forming a Schottky junction between the first semiconductor layer 1 and itself; and the first electrode 5 and the second electrode 6 are formed of materials having leakage current temperature characteristics different from each other. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP5333893(B2) 申请公布日期 2013.11.06
申请号 JP20080162766 申请日期 2008.06.23
申请人 发明人
分类号 H01L21/822;H01L27/04;H01L29/47;H01L29/872 主分类号 H01L21/822
代理机构 代理人
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