发明名称 |
Object having internal cavities, light emitting diode assembly |
摘要 |
An object with an internal cavity may serve as a cooling structure for a semiconductor package. The object includes a stack of form fitting bodies. The stack has a first form fitting body shaped according to the cavity with a first layer forming a partially form fitting surface, the first layer including a mixture of a first metal and an oxide of the first metal, and a second layer adjacent to the first layer. The second layer includes the first metal but less oxide of the first metal than the first layer. The stack has a second form fitting body shaped according to the cavity with a first layer forming a partially form fitting surface configured to conform to the partially form fitting surface of the first form fitting body.
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申请公布号 |
US8573814(B2) |
申请公布日期 |
2013.11.05 |
申请号 |
US201313770314 |
申请日期 |
2013.02.19 |
申请人 |
EXCELITAS TECHNOLOGIES GMBH & CO KG;EXCELITAS TECHNOLOGIES GMBH & CO. KG |
发明人 |
TRAUPE ULRICH;BALLACCHINO PELLEGRINO;SPANDL EDGAR |
分类号 |
F21V29/00 |
主分类号 |
F21V29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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