发明名称 A thickness monitoring system in etching process of glass substrate
摘要 PURPOSE: A system for monitoring the thickness of an etched glass substrate is provided to monitor the thickness of the substrate being etched by an etchant, and to control the operation variables of a jetting part jetting the etchant using a monitored result, thereby accurately adjusting the thickness of the substrate to a predetermined thickness. CONSTITUTION: A system for monitoring the thickness of an etched glass substrate includes a chamber (2), the glass substrate (30), a jetting part (20), an optical thickness meter (40), and a control part. The substrate is installed inside the chamber. The jetting part inside the chamber jets an etchant to the substrate. The optical thickness meter monitors the thickness of the substrate etched inside chamber using an optical measuring method. The control part controls the operation variables of the jetting part according to the thickness measured by the optical thickness meter.
申请公布号 KR101323152(B1) 申请公布日期 2013.11.04
申请号 KR20120012582 申请日期 2012.02.08
申请人 发明人
分类号 C03C25/68;G01B11/06 主分类号 C03C25/68
代理机构 代理人
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