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发明名称
具温度补偿的二极体元件
摘要
一种具温度补偿的二极体元件,包含一负温度系数二极体及一正温度系数二极体。正温度系数二极体串联于负温度系数二极体,且负温度系数二极体与正温度系数二极体以相同半导体极性之一端彼此电性连接。藉此,可抵销因温度造成的电压飘移现象。
申请公布号
TWM464823
申请公布日期
2013.11.01
申请号
TW102200467
申请日期
2013.01.09
申请人
力神科技股份有限公司 桃园县桃园市中山路543号7楼
发明人
何政豪
分类号
H01L33/00
主分类号
H01L33/00
代理机构
代理人
李文贤 新北市板桥区民生路1段33号17楼之3
主权项
地址
桃园县桃园市中山路543号7楼
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