STRUCTURE OF HEAT-RADIATING SUBSTRATE HAVING ELECTRICAL ISOLATED THERMAL BRIDGE AND METHOD FOR FABRICATING THE SAME

摘要

The present invention relates to a structure of a heat-radiating substrate having an electrically insulated and isolated thermal bridge and a manufacturing method thereof. The structure of a heat-radiating substrate in the present invention includes a heat-radiating bridge in a cylindrical or polygonal pillar shape which includes a mounting surface for an LED chip or an LED package on the top and is made of metal; an insulation layer which surrounds the heat-radiating bridge on the lateral side of the heat-radiating bridge; and a plurality of circuit pattern layers which is place at an interval from the heat-radiating bridge, the top side of which is on the same plane as the mounting surface of the heat-radiating bridge, and which is made of metal. Given in the present invention, by having a heat-radiating bridge with an electrically isolated area, the heat from an LED chip or an LED package can be effectively discharged to the outside. Furthermore, by omitting a process of forming a separate terminal, the manufacturing process can be streamlined.