| 摘要 |
PROBLEM TO BE SOLVED: To secure sufficient fixing strength of a lead frame to an integrally molded resin structure even when the lead frame is narrowed in accordance with an electrode of an optical element to be flip-chip bonded.SOLUTION: In a substrate 20 for an optical module which is composed of a plurality of lead frames 31 to 35 and a resin structure 40 molded integrally with the lead frames 31 to 35 and in which optical element mounting parts 51 and 52 and optical waveguide body mounting parts 53 are formed on the resin structure 40, the lead frames 31 to 35 have connections 31a to 35a on which optical elements are loaded and electrically connected, and lead parts 31b to 35b following the connections 31a to 35a. The connections 31a to 35a are located in the optical element mounting parts 51 and 52 while a part thereof in the width direction is buried in the resin structure 40. |
