发明名称 ENCAPSULATION FOR ORGANIC LIGHT-EMITTING DIODE DISPLAY BOARD AND ITS MANUFACTURING METHOD
摘要 <p>PURPOSE: An encapsulation for an organic light emitting diode display board and a method for manufacturing the same are provided to improve intensity and durability by lightening the total weight of the organic light emitting diode display board. CONSTITUTION: A main plate (10) is made of aluminum. The thickness of the aluminum is 0.8-1.2 mm. An assistant plate (20) is made of aluminum. The thickness of the assistant plate is 0.3-0.7 mm. The main plate and the assistant plate are bonded to each other by using an adhesive (40).</p>
申请公布号 KR20130119403(A) 申请公布日期 2013.10.31
申请号 KR20130119867 申请日期 2013.10.08
申请人 NAM, HO JIN 发明人 NAM, HO JIN
分类号 H01L51/52;H05B33/04;H05B33/10 主分类号 H01L51/52
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