发明名称 |
ENCAPSULATION FOR ORGANIC LIGHT-EMITTING DIODE DISPLAY BOARD AND ITS MANUFACTURING METHOD |
摘要 |
<p>PURPOSE: An encapsulation for an organic light emitting diode display board and a method for manufacturing the same are provided to improve intensity and durability by lightening the total weight of the organic light emitting diode display board. CONSTITUTION: A main plate (10) is made of aluminum. The thickness of the aluminum is 0.8-1.2 mm. An assistant plate (20) is made of aluminum. The thickness of the assistant plate is 0.3-0.7 mm. The main plate and the assistant plate are bonded to each other by using an adhesive (40).</p> |
申请公布号 |
KR20130119403(A) |
申请公布日期 |
2013.10.31 |
申请号 |
KR20130119867 |
申请日期 |
2013.10.08 |
申请人 |
NAM, HO JIN |
发明人 |
NAM, HO JIN |
分类号 |
H01L51/52;H05B33/04;H05B33/10 |
主分类号 |
H01L51/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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